Thermal compound

Cpu Cooling Systems- thermal compound, thermal paste, heatsink compound, heat sinks paste

Heat sinks compound / thermal compound is a white paste silicone product heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. Up to approximately 300oC, the product is very stable to changes of temperature. It helps to maintain a positive heat sink seal that improves heat transfer from the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices.

Uses

Heat sinks paste / thermal paste is used to the base and mounting studs of transistors, diodes, cpu heat sinks, computer cooling, cpu cooling systems, thermal heat transfer, thermal transfer and silicon-controlled rectifiers. It can also serve as a thermal coupler for many heat sink devices where efficient cooling is required. This product has also been applied as a high voltage corona-suppressant, non-flammable coating in connections for fly-back transformers in TV sets and similar applications.