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0  Epoxy potting / encapsulating / casting / coating / sealant Compound series

Epoxy potting/encapsulating/coating/casting/sealant compounds

RTV (room temperature) / Heating epoxy compound, insulating materials for Electronic & Electrical components

Fong Yong 's RTV / Heating epoxy potting / encapsulating resin / compound be used widely in Electrical and Electronic Industry -> electronic / electrical potting and encapsulating coating --> epoxy compound, insulating materialss, encapsulating coatings, casting, threat sealant, high temperature sealants, industrial sealants, filling, insulating materials, thermal insulation, impregnating for most electronic components and electronic applications and insulation materials.

Hard type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- Flexible type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- UL 94V0 series - epoxy formulated compound

- one compound - epoxy formulated compound

diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

UL 94V0 series - epoxy, silicone formulated compound

POTTING, ENCAPSULATING, SEALANT, SEALANTS, COATING, ELENTRONIC ELENTRICAL COMPONENTS, INSULATING MATERIALS electronic electrical components, coating, casting, two / one epoxy potting compound, RTV heat epoxy,insulating materials, threat sealant, industrial sealants, puring resin TWO PARTS RESIN ENCAPSULATING COMPOUNDS

Hard type of two parts epoxy mold for encapsulating potting compounds in clear/color resin

E-128B/H-128

BLACK

3:1

5000/60

Good weather resistance, high tensile strngth, very suitable for electrical & electronic insulating, potting & encapsulating

E-190B/H-190

Black

100:40

4400/100

good electrical properties, low reactive energy, suitable for large electronic parts potting

E-226/H-120

Red

100:40-50

Paste/1200

easy handle, nan-sag, suitable for large electronic components adhesive impregnating

E-890A/H-105

clear

2:1

2400/1500

good weather resistance, high gloss surface, suitable for electronic components casting or film coating

E-590B-1/H-590

Black

100:20

25000/110

good weather resistance and thmeral conductivty, suitable for electronic components insulating potting and encapsulating

E-759BH/H-759H

Black

100:30

75000/9500

good weather resistance, longer pot-life, good thermal conductivty, suitable for electronic parts potting, encapsulating, casting and sealant

E-5260B/H-5260

Black

100:80

600/100

high tensile strength, low viscosity, suitable for insulating, potting, encapsulating, cating

E-5600B/H-5600

Black

2:1

3000/600

good electrical properties, easy handle, high temperature resistance, suitable for electrical & electronic insulating, potting, encapsulating and casting

E-120/H-100

colors

3:1

2100/30

easy handle, low viscosity, general used.

E-769B/H-769

Black

4:1

paste/1200

higher viscosity, suitable for capacitor coating, water proof, insulating, film protect, COB coating

E-1009/H-1009

colors

3:1

paste/100

midle viscosity, high temperature resistance, high thermal conductivity, hating curing type, suitable for large electronic components casting

E-638/H-638

colors

100:28

paste/110

higher viscosity, high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles

E-566B/H-566

Black

3:1

4500/600

midle high voltage resistance, high thermal conductivity, l ow temperature resistance, suitable for high volt ignition for vehicles

E-311W/H-311

White

2:1

15000/12000

thermal compound, thermal conductivity : 0.4W/mk

Flexible of two parts epoxy mold for potting encapsulating compound in clear / color resin

E-185B/H-185B

BLACK

3:1

1050/40

easy handle, low viscosity, low elastic, suitable for delicate electrical and electronic components potting and encapsulating

E-721B/H-721

Black

1:1

900/200

high tensile strength, elastic, low viscosity, low stress, suitable for delicate electrical components potting, encapsulating and casting

E-768/H-768

Black/Blue

100:60

2800/100

good weather resistance, low temperature resistance, elastic, RTV cured, excellent electrical properties, suitable for electronic parts potting and encapsulating

E-7311B/H-7311

Black/Clear

100:30

4000/100

easy handle, good impact strength and low temperature resistance suitable for electrical & electronic insulating, potting, encapsulating

E-X2/H-X2

colors

2:1

6000/120

super flexible, good low temperature resistance and impact strength

E-806B/H-806

Black

100:25

20000/300

flexible type, suitable for delicate electrical components insulating, potting, encapsulating and casting, low temperature more than -30 degree C

one compound - epoxy formulated compound

E-1200

BLACK

4000

good fluidity, low temperature curable

for small area potting of electric products

E-1385B

Red thixtropic

150000

fast cure short term high temperature resistance (280 oC)

SMT adhesive, screen printing

EP-A

BLACK

40000-50000

curing for low temperature good adhesive

IC sealing or electronic components adhesives

EP-A-2

Black/Clear

70000

curing for low temperature good adhesives

IC sealing or electronic components adhesives

EP-10-C

Black

80000

curing for medial temperature, good adhesives

IC sealing or electronic components adhesives

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epoxy potting encapsulating compounds, insulating materials, sealants, coating
UL94V0 potting compound, insulating materials, sealants, coating
silicone potting/sealant/coating compounds
doming resin - polyurethane (urethane, PU), epoxy

polyurethane doming resin

crystal clear two parts epoxy doming -- hard (rigid) type system

crystal clear two parts epoxy doming -- soft (flexible) type system

crystal clear two parts epoxy doming -- non-sag type system

epoxy potting/ encapsulating/ coating/ sealant compounds

color systems

Machine information

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FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@ms23.hinet.net